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DFG860

Time:2019-12-02   Browse times:352second

Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning.
Production date: 2004
Rated power: ac200v, 50 / 60Hz, 21kwv
Compressed air: 0.5MPa 350l/mi
Grinding water: 0.2MPa 25L / min
L cooling water: 0.2MPa 9L / min
Weight: 5000kg


Equipment name:
Grinder thinning machine
Manufactor:
DISCO
Model:
DFG860
Particular year:
2004
Equipment status:
Working









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  • Contact information
  • Address: No.8 workshop, no.225,
    Huajin Road,Tong'an Town,
    high tech Zone, Suzhou
  • Tel: +86) 0512-6937-0370
  • Fax: +86) 0512-6937-0369
  • E-mail: sales@ssmc.com.cn
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Address: No.8 workshop, no.225, Huajin Road, Tong'an Town, high tech Zone, Suzhou; tel.: + 86) 0512-6937-0370
Mobile: 18051228778 Fax: + 86) 0512-6937-0369 email: sales@ssmc.com.cn