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Time:2020-03-26   Browse times:577second

Specially designed for advanced IC and discrete packages,AD8312 provides a high speed automatic epoxy die bonding
solution for alround IC and discrete applications. The high speed bonding performance and ecellent accuracy of ±1 mil@ 3 σ and MS Windows@ operating system makes AD8312 a perfect fit for your IC and discrete assembly solution.
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  • Contact information
  • Address: No.8 workshop, no.225,
    Huajin Road,Tong'an Town,
    high tech Zone, Suzhou
  • Tel: +86) 0512-6937-0370
  • Fax: +86) 0512-6937-0369
  • E-mail:
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Address: No.8 workshop, no.225, Huajin Road, Tong'an Town, high tech Zone, Suzhou; tel.: + 86) 0512-6937-0370
Mobile: 18051228778 Fax: + 86) 0512-6937-0369 email: