The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 μm.Optionally, the accuracy can even be improved, down to 15 μm.Minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest settling times imaginable, which ultimately lead to the unsurpassed speed of the Die Bonder Esec 2100 xPplus.
