Improve processing stability and achieve higher productivity efficiency Dgp8761 is an improved model of dgp8760 with outstanding global sales performance. The machine realizes the integration of back grinding and residual stress removal technology, and can stably realize the thin machining with thickness less than 25 μ M. The newly developed spindle is also equipped, which is suitable for high-speed grinding and machining. It helps to shorten the processing time of thin wafer (compared with dgp8760). In addition, the reasonable layout of the handling mechanism shortens the production time beyond the processing. Various applications of the third spindle The third spindle application for wafer machining includes the following. Remove residual stress ● environmental protection, no "dry polishing" with liquid medicine or water ● CMP (special option) Ultra precision grinding (special option) Poligrind ●UltraPoligrind
