Time：2019-12-03 Browse times：981second
AD838 is an automatic high speed epoxy die bonder with up to 4" (101.6 mm) substrate width handling capability, It
is highly flexible in handling wide range of die sizes for your IC and discrete packages. Together with high precision linear motorizing system, patented bond head system, dual dispensing system and advanced inspection system, AD838 must be your only choice for die attach process.
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Equipment name: |
Solidifying machine and laminating machine |
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Manufactor: |
ASM |
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Model: |
AD8312 |
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Particular year: |
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Equipment status: |
Working |
