PEELING membrane

Back Grinding Tape

tape, produced by DENKA, enables to remove used BG tape from your workpiecepiece very smoothly. There are three types of P tapes, with different tape width for workpiecepiece size.

Feature

Dust-free type (usable for clean rooms)

Stable peeling strength

Reasonable price

＊The above data is just for representing value, and not guaranteed value.
＊ T (Transparent)
＊Separator thickness is not included.

Our company acts as agent for DENKA tape in Japan. The former name of DENKA tape is Toyo tape
DENKA tape includes four films:
1. BG tape, grinding protective film, including UV type and non UV type.
2. Non UV tape, cutting film, usually blue or white.
3. UV tape, cutting film, can also be used for grinding protection.
4. Peeling tape, used for uncovering after grinding.
Application fields:
1. Grinding protection of semiconductor wafer
2. Cutting process of semiconductor wafer
3. Cutting process of semiconductor back section substrate / copper frame
4. Cutting process of ceramic substrate
5. Cutting process of LED base plate
6. Glass product cutting process
Characteristic:
1. As the agent appointed by DENKA, we have sufficient samples of different types and sizes in our factories in Suzhou and Shenzhen for our customers to choose and test.
2. We have a special UV film application laboratory, which can choose tape according to the actual products of customers, provide cutting test, and finally evaluate whether our products are suitable for the application of customers.
3. Our company is engaged in grinding and cutting OEM business. We have safety stock for common membranes. We can provide emergency delivery support for our customers.