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Cutting film

Time:2019-12-05   Browse times:250second



Equipment name: 
Cutting film
 Manufactor:  
DENKA
Model: 
Cutting film
 Particular year: 

 Equipment status:











Back Grinding Tape -P Series-
A back grinding tape (hereafter as BG tape) is used for protecting the circuit surface from scratches, chipping / crack and particle contamination, during the back-grinding process. The functions of BG tapes are (1) protecting workpiece surface from contamination, (2) highly close contact to workpiece and (3) easiness of peeling, and higher technology to those functions is required with the developments of jumbo-sized and thinned wafer and high-bumped wafer. Elegrip BG tapes produced by DENKA do not require to rinse your workpiece after BG process due to excellent adhesive. We Toyo Adtec consider needs of each user and choose appropriate tapes.

Feature
Excellent contact to asperity of the circuit side
Effective control of particle
Good water-seepage control
Excellent grinding accuracy (TTV)
Easy peeling
Effective control on adhesive deterioration with time


Product Number

Base Film

Color

Total Thickness
(μm)

Adhesive Thickness
(μm)

BGE-122S

EVA

LB

140

20

BGE-122V

BGE-1240A6

160

40

BGE-124S

BNY-1250A3

170

50

BNY-1250A4

BGE-164VC

200

40

*The above data is just for representing value, and not guaranteed value.
*Color : MW (Milky White), B (Llight Blue), T (Transparent)
*Separator thickness is not included.

Our company acts as agent for DENKA tape in Japan. The former name of DENKA tape is Toyo tape
DENKA tape includes four films:
1. BG tape, grinding protective film, which is divided into UV type and non UV type.
2. Non UV tape, cutting film, usually blue or white.
3. UV tape, cutting film, can also be used for grinding protection.
4. Peeling tape, used for uncovering after grinding.
Application fields:
1. Grinding protection of semiconductor wafer
2. Cutting process of semiconductor wafer
3. Cutting process of semiconductor back section substrate / copper frame
4. Cutting process of ceramic substrate
5. Cutting process of LED base plate
6. Glass product cutting process
Characteristic:
1. As the agent appointed by DENKA, we have sufficient samples of different types and sizes in our factories in Suzhou and Shenzhen for our customers to choose and test.
2. We have a special UV film application laboratory, which can choose tape according to the actual products of customers, provide cutting test, and finally evaluate whether our products are suitable for the application of customers.
3. Our company is engaged in grinding and cutting OEM business. We have safety stock for common membranes. We can provide emergency delivery support for our customers.


Return list
  • Contact information
  • Address: No.8 workshop, no.225,
    Huajin Road,Tong'an Town,
    high tech Zone, Suzhou
  • Tel: +86) 0512-6937-0370
  • Fax: +86) 0512-6937-0369
  • E-mail: sales@ssmc.com.cn
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Address: No.8 workshop, no.225, Huajin Road, Tong'an Town, high tech Zone, Suzhou; tel.: + 86) 0512-6937-0370
Mobile: 18051228778 Fax: + 86) 0512-6937-0369 email: sales@ssmc.com.cn